6358升级64M RAM成功

wyfme

   怎么从编号看内存容量啊

MINE

不知道FLASH能不能换。

yf3899

高手啊，ram都能换！

天涯

14楼这个超强内存条啊.便宜又实惠,不错的选择.

天涯

21楼的朋友,我收集的一点数据资料

1. 8Mx16 SDR IS42S16800D      3.3V 4K 16M  70ns ISSI
   
2. 8Mx16 SDR IS42S16800E      3.3V 4K 16M  70ns
   
3. 
   
4. 8Mx16 SDR M12L128168A-7TG  3.3V 4K 16M  70ns ESMT
   
5. 8Mx16 SDR M12L2561616A-7TG 3.3V 4K 32M  70ns
   
6. 
   
7. HYB39SC128160FE-7 128Mb, 8Mx16, SDR-143 3-3-3 PG-TSOPII-54
   
8. HYI39SC128160FE-7 128Mb, 8Mx16, SDR-143 3-3-3 PG-TSOPII-54
   
9. 
   
10. samsung
    
11. K 4 X X X X X X X X  -  X  X  X  X  X  X  X   sdr
    
12. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
    
13. K 4 S 2 8 1 6 3               7  0
    
14. ____________________________________________________________
    
15. 
    
16. 8Mx16 SDR EDS1216AHTA      3.3V 4K 16M  75ns
    
17. 
    
18. HY5DU121622BT  x16 2.5V 8K Ref. D43/J/K/H/L Normal Power TSOP EOL    512Mb/8=64M DDR1
    
19. HY5DU121622BTP x16 2.5V 8K Ref. D43/J/K/H/L Normal Power TSOP EOL
    
20. HY5DU121622CTP x16 2.5V 8K Ref. D43/J/K/H/L Normal Power TSOP EOL
    
21. ------------------------------------------------------------------
    
22. HY57V281620FTP   x16 3.3V 5/6/7/H Low Power  TSOP                    128Mb/8=16M SDR
    
23. HY57V561620FT(P) x16 3.3V 6/H     Normal/Low TSOP                    256Mb/8=32M
    
24. 
    
25. Infineon
    
26. HYB39S128160 128Mb       x 16 3.3V
    
27. HY39S128400  128Mb  32 M x 4  3.3V
    
28. HY39S128800  128Mb  16 M x 8  3.3V
    
29. 
    
30. etron
    
31. 256Mb        16Mx16        EM63A165TS                6, 7        3.3V, LVTTL        54-pin TSOPII
    
32. 128Mb        8Mx16        EM639165TS/VM                6, 7        3.3V, LVTTL        54-pin TSOPII
    
33. 128Mb        8Mx16        EM639165TS/VM-XXI        6, 7        3.3V, LVTTL        54-pin TSOPII
    
34. 
    
35. qimonda
    
36. HYB39SC256160FE-7 256Mb, 16Mx16, SDR-143 3-3-3 PG-TSOPII-54  
    
37. HYB39SC256160FE-6 256Mb, 16Mx16, SDR-166 3-3-3 PG-TSOPII-54
    
38. HYI39SC256160FE-7 256Mb, 16Mx16, SDR-143 3-3-3 PG-TSOPII-54
    
39. HYI39SC256160FE-6 256Mb, 16Mx16, SDR-166 3-3-3 PG-TSOPII-54
    
40. HYB39SC128160FE-7 128Mb, 8Mx16, SDR-143 3-3-3 PG-TSOPII-54
    
41. HYI39SC128160FE-7 128Mb, 8Mx16, SDR-143 3-3-3 PG-TSOPII-54
    
42. HYI39SC128160FE-6 128Mb, 8Mx16, SDR-166 3-3-3 PG-TSOPII-54
    
43. HYB39SC128160FE-6 128Mb, 8Mx16, SDR-166 3-3-3 PG-TSOPII-54
    
44. HYB39S512160AT-7.5 512Mb, 32M x 16, PC133 3-3-3 P-TSOPII-54
    
45. HYB39S512160AE-7.5 512Mb, 32M x 16, PC133 3-3-3 PG-TSOPII-54
    
46. HYB39S128160AT-7.5 128Mb, 8M x 16, PC133 3-3-3 P-TSOPII-54
    
47. HYB39S128160AE-7.5 128Mb, 8M x 16, PC133 3-3-3 PG-TSOPII-54  
    
48. ------------------------------------------------------------
    
49. HYI25D512160DT-5 512Mb, 32Mx16, DDR400 3-3-3 P-TSOPII-66
    
50. HYI25D512160DE-5 512Mb, 32Mx16, DDR400 3-3-3 PG-TSOPII-66
    
51. HYB25D512160CE-5 512Mb, 32Mx16, DDR400 3-3-3 PG-TSOPII-66
    
52. 
    
53. 
    
54. samsung
    
55. K 4 X X X X X X X X  -  X  X  X  X  X  X  X   sdr
    
56. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
    
57. K 4 S 2 8 1 6 3               7  0
    
58. K 4 S 2 8 1 6 3               7  5
    
59.     ^
    
60. K 4 X X X X X X X X  -  X  X  X  X  X  X  X   ddr
    
61. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
    
62. K 4 H 5 1 1 6 3               
    
63. K 4 H 5 1 1 6 3 2    -  u         
    
64.     ^
    
65. 
    
66. 
    
67. 
    
68. samsung
    
69. K 4 X X X X X X X X  -  X  X  X  X  X  X  X   
    
70. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
    
71. K 4 S 2 8 1 6 3               7  0
    
72. K 4 S 2 8 1 6 3               7  5
    
73. 
    
74. 1. Memory (K)
    
75. 2. DRAM : 4
    
76. 3. Small Classification
    
77. S : SDRAM
    
78. 4~5. Density,Refresh
    
79. 16 : 16M, 2K/32ms
    
80. 28 : 128M, 4K/64ms
    
81. 51 : 512M, 8K/64ms
    
82. 56 : 256M, 8K/64ms
    
83. 64 : 64M, 4K/64ms
    
84. 1G : 1G, 8K/64ms
    
85. 6~7. Organization
    
86. 04 : x4
    
87. 06 : x4 Stack
    
88. 07 : x8 Stack
    
89. 08 : x8
    
90. 16 : x16
    
91. 32 : x32
    
92. 8. Bank
    
93. 2 : 2 Bank
    
94. 3 : 4 Bank
    
95. 9. Interface, VDD, VDDQ
    
96. 2 : LVTTL, 3.3V, 3.3V
    
97. L : LVCMOS, 2.5V, 2.5V
    
98. 10. Generation
    
99. 11. “—”
    
100. 12. Package
     
101. N : STSOP2
     
102. T : TSOP2
     
103. U : TSOP2 (Lead-Free)
     
104. L : TSOP2 (Lead-Free & Halogen-Free)
     
105. V : STSOP2 (Lead-Free)
     
106. Note : In a special case, TSOP2 package code “-U” of
     
107. SDR 256Mb J-die/128Mb K-die and sTSOP2 “V” of
     
108. 256Mb J-die stand for Lead-free and Halogen free,
     
109. 13. Temp, Power
     
110. C : Commercial, Normal ( 0℃ ~ 70℃ )
     
111. L : Commercial, Low ( 0℃ ~ 70℃ )
     
112. I : Industrial, Normal ( -40℃ ~ 85℃)
     
113. P : Industrial, Low ( -40℃ ~ 85℃)
     
114. E : Extended, Normal ( -25℃ ~ 85℃)
     
115. N : Extended, Low ( -25℃ ~ 85℃)
     
116. 14~15. Speed ( Wafer / Chip Biz / BGD : 00 )
     
117. 50 : 5ns
     
118. 55 : 5.5ns
     
119. 60 : 6ns
     
120. 70 : 7ns
     
121. 75 : 7.5ns, PC133
     
122. 80 : 8ns
     
123. -------------------------------------------------------------
     
124. K 4 X X X X X X X X  -  X  X  X  X  X  X  X
     
125. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
     
126. 1. Memory (K)
     
127. 2. DRAM : 4
     
128. 3. Small Classification
     
129. H : DDR SDRAM
     
130. 4~5. Density, Refresh
     
131. 64 : 64Mb, 4K/64ms
     
132. 28 : 128Mb, 4K/64ms
     
133. 51 : 512Mb, 8K/64ms
     
134. 56 : 256Mb, 8K/64ms
     
135. 1G : 1Gb, 8K/64ms
     
136. 2G : 2Gb, 8K/64ms
     
137. 6~7. Organization
     
138. 04 : x4
     
139. 08 : x8
     
140. 16 : x16
     
141. 32 : x32
     
142. 06 : x4 Stack
     
143. 07 : x8 Stack
     
144. 8. Bank
     
145. 3 : 4Bank
     
146. 9. Interface, VDD, VDDQ
     
147. 8 : SSTL-2, 2.5V, 2.5V
     
148. 10. Generation
     
149. 11. "─"
     
150. 12. Package
     
151. T : TSOP2
     
152. U : TSOP2 (Lead Free)
     
153. L : TSOP2 (Lead-Free & Halogen-Free)
     
154. N : sTSOP2
     
155. V : sTSOP2 (Lead Free)
     
156. 6 : sTSOP2 (Lead-Free & Halogen-Free)
     
157. G : FBGA
     
158. Z : FBGA (Lead Free)
     
159. H : FBGA (Lead-Free & Halogen-Free)
     
160. F : FBGA for DDR 64Mb/128Mb
     
161. (Lead-Free & Halogen-Free)
     
162. 13. Temp, Power
     
163. C : Commercial, Normal ( 0℃ ~ 70℃ )
     
164. L : Commercial, Low ( 0℃ ~ 70℃ )
     
165. I : Industrial, Normal ( -40℃ ~ 85℃)
     
166. P : Industrial, Low ( -40℃ ~ 85℃)
     
167. 14~15. Speed (Wafer/Chip Biz/BGD: 00)
     
168. CC : DDR400 ( 200MHz @ CL=3, tRCD=3, tRP=3 )
     
169. B3 : DDR333 ( 166MHz @ CL=2.5, tRCD=3, tRP=3 )
     
170. AA : DDR266 ( 133MHz @ CL=2, tRCD=2, tRP=2 )
     
171. A2 : DDR266 ( 133MHz @CL=2, tRCD=3, tRP=3 )
     
172. B0 : DDR266 ( 133MHz @ CL=2.5, tRCD=3, tRP=3 )
     
173. =====================================================================================
     
174. HY5DU121622DTP-D43 64M
     

复制代码

sys0719

强。。。。。！

6331805

动手能力真强！忍不住，再顶一下！

mzdeng

手工费的话到修电子那焊一下也就10元，现在是内存比较少见到啊，要不我去买条KST 512M DDR400的来拆，我用完一个后还剩下7个有谁要的吗？10元一个吧，如果有人要的话我就去买条来焊，不然我自己一个人用的话，80焊个内存感觉没什么意思一样。。

wyfme

内存到了  明天去换  嘎嘎  自己没风枪哦

wyfme

昏迷啊  一样的编码 焊上去居然是16M的内存  我可是一个普通烙铁焊的啊   要晕死哦